Say goodbye to the camera bump with this smartphone concept
Engineers at Germany's Fraunhofer Institute have developed a smartphone camera module that's thin enough to be squeezed inside a smartphone, removing the need for a "camera bump" without compromising on quality.
On most modern smartphones, the camera necessitates a bump on the back of the phone. That's because the focal length of the lenses and camera assembly cannot be made any thinner.
The concept from Fraunhofer does things differently.
It uses four image sensors rotated 90 degrees so they point out of the side of the phone. A set of tiny mirrors in front of the sensors reflects the image from the front or rear of the phone.
The basic concept would have worked with a single mirror, said Jacques Duparré, a senior scientist at Fraunhofer's Microoptical Imaging Systems lab in Jena, Germany.
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