Tokyo Tech's BBCube Technology to drive new next-generation 3D integration manufacturing lines by Tech Extension Co. and Tech Extension Taiwan Realizing social implementation of next-generation 3D stacked semiconductor technology
Tokyo Institute of Technology's WOW Alliance[1] has facilitated a groundbreaking agreement between Tech Extension Co., Ltd. (TEX)[2], Tech Extension Taiwan Co., Ltd. (TEX-T)[3], and Innolux Corporation (INNOLUX)[4] to construct a next-generation 3D integration[5] manufacturing line using the Bumpless Build Cube (BBCube)[6] technology in an INNOLUX cleanroom.
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